John Pennacchia, Ph.D.
John Pennacchia is a Senior Project Engineer for IBM in the Systems & Technology Group of the Microelectronics Division. He has 28 years of experience in development and manufacturing in Electronics Packaging.
He has held technical and managerial positions at various levels of responsibility during his career. Areas John’s expertise include: Wafer Solder bumping, electroplating for Lead and Lead-Free solders, Thin Films multi-layer Process and materials for electronic packaging devices and Multilayer Ceramics.
John holds several patents and internal corporate publications. He has received three outstanding technical achievement awards at the corporate level. His focus is on process integration from development into manufacturing as well as processes and controls for Lead-free electroplating. He holds a PhD (1986) and MS (1984) from Polytechnic University in Polymer Chemistry, historically known as “Brooklyn Poly” (currently NYU Polytechnic School of Engineering). He also holds a BS (1981) in Chemistry from Iona College. John resides in the Mid-Hudson Valley in Wappingers Falls, N.Y., with his wife and three children.